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116-93-432-41-007000 Mill-Max Manufacturing Corp.


2017-11%3A111.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
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Technische Details 116-93-432-41-007000 Mill-Max Manufacturing Corp.

Description: CONN IC DIP SOCKET 32POS GOLD, Part Status: Active, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 200.0µin (5.08µm), Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 32 (2 x 16), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.4" (10.16mm) Row Spacing, Mounting Type: Through Hole, Features: Elevated, Open Frame, Packaging: Tube, Contact Finish - Post: Tin-Lead, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold.

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116-93-432-41-007000 Hersteller : Mill-Max 2017-11%3A111.pdf IC & Component Sockets 32 PIN ELEVATED SKT .402L
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Im Einkaufswagen  Stück im Wert von  UAH