Produktrezensionen
Produktbewertung abgeben
Technische Details 12-0518-10T Aries Electronics
Description: CONN SOCKET SIP 12POS GOLD, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 12 (1 x 12), Type: SIP, Mounting Type: Through Hole, Features: Open Frame, Packaging: Bulk.
Weitere Produktangebote 12-0518-10T
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| 12-0518-10T | Hersteller : Aries Electronics |
Description: CONN SOCKET SIP 12POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 12 (1 x 12) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
