| Anzahl | Preis |
|---|---|
| 1+ | 12.06 EUR |
| 10+ | 10.24 EUR |
| 25+ | 9.59 EUR |
| 100+ | 8.71 EUR |
| 250+ | 8.17 EUR |
| 500+ | 7.76 EUR |
| 1000+ | 7.39 EUR |
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Technische Details 123-13-316-41-001000 Mill-Max
Description: CONN IC DIP SOCKET 16POS GOLD, Part Status: Active, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Termination: Wire Wrap, Number of Positions or Pins (Grid): 16 (2 x 8), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester.
Weitere Produktangebote 123-13-316-41-001000 nach Preis ab 9.12 EUR bis 12.14 EUR
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123-13-316-41-001000 | Hersteller : Mill-Max Manufacturing Corp. |
 Description: CONN IC DIP SOCKET 16POS GOLDPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Termination: Wire Wrap Number of Positions or Pins (Grid): 16 (2 x 8) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
auf Bestellung 42 Stücke: Lieferzeit 10-14 Tag (e) |
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