14-3518-10 Aries Electronics
| Anzahl | Privatkunde |
|---|---|
| 1+ | 3.58 EUR |
| 10+ | 3.09 EUR |
| 28+ | 2.62 EUR |
| 112+ | 2.45 EUR |
| 252+ | 2.26 EUR |
| 504+ | 2.14 EUR |
| 1008+ | 2.12 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Produktrezensionen
Produktbewertung abgeben
Technische Details 14-3518-10 Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 14 (2 x 7), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass.
Weitere Produktangebote 14-3518-10 nach Preis ab 1.59 EUR bis 6.07 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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14-3518-10 | Aries Electronics |
 Description: CONN IC DIP SOCKET 14POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
auf Bestellung 740 Stücke: Lieferzeit 10-14 Tag (e) |
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14-3518-10 | ARIES |
Description: ARIES - 14-3518-10 - IC- & Baustein-Sockel, 14 Kontakt(e), DIP, 2.54 mm, 518, 7.62 mm, Berylliumkupfer tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Berylliumkupfer isCanonical: Y Anzahl der Kontakte: 14Kontakt(e) Reihenabstand: 7.62mm Steckverbinder: DIP Produktpalette: 518 productTraceability: No usEccn: EAR99 Rastermaß: 2.54mm |
auf Bestellung 839 Stücke: Lieferzeit 14-21 Tag (e) |
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| 14-3518-10 | Aries Electronics |
Conn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole |
auf Bestellung 1064 Stücke: Lieferzeit 14-21 Tag (e) |
|
| 14-3518-10 |
|
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
auf Bestellung 740 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 3.69 EUR |
| 10+ | 3.14 EUR |
| 28+ | 2.92 EUR |
| 56+ | 2.78 EUR |
| 112+ | 2.64 EUR |
| 252+ | 2.5 EUR |
| 504+ | 2.38 EUR |
| 14-3518-10 |
|
Hersteller: ARIES
Description: ARIES - 14-3518-10 - IC- & Baustein-Sockel, 14 Kontakt(e), DIP, 2.54 mm, 518, 7.62 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 14Kontakt(e)
Reihenabstand: 7.62mm
Steckverbinder: DIP
Produktpalette: 518
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
Description: ARIES - 14-3518-10 - IC- & Baustein-Sockel, 14 Kontakt(e), DIP, 2.54 mm, 518, 7.62 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 14Kontakt(e)
Reihenabstand: 7.62mm
Steckverbinder: DIP
Produktpalette: 518
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
auf Bestellung 839 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 42+ | 6.07 EUR |
| 56+ | 4.2 EUR |
| 100+ | 3.08 EUR |
| 250+ | 2.89 EUR |
| 14-3518-10 |
|
Hersteller: Aries Electronics
Conn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole
Conn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole
auf Bestellung 1064 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 79+ | 2.27 EUR |
| 252+ | 1.82 EUR |
| 504+ | 1.7 EUR |
| 1008+ | 1.59 EUR |