14-810-90T Aries Electronics
| Anzahl | Preis |
|---|---|
| 1+ | 13.39 EUR |
| 10+ | 10.89 EUR |
| 25+ | 9.45 EUR |
| 100+ | 8.89 EUR |
| 250+ | 8.2 EUR |
| 500+ | 8.01 EUR |
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Technische Details 14-810-90T Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN, Part Status: Active, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Phosphor Bronze, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Termination: Solder, Number of Positions or Pins (Grid): 14 (2 x 7), Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Right Angle, Vertical, Features: Closed Frame, Packaging: Bulk.
Weitere Produktangebote 14-810-90T nach Preis ab 10.79 EUR bis 15.05 EUR
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14-810-90T | Hersteller : Aries Electronics |
 Description: CONN IC DIP SOCKET 14POS TINPart Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6 Termination: Solder Number of Positions or Pins (Grid): 14 (2 x 7) Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole, Right Angle, Vertical Features: Closed Frame Packaging: Bulk |
auf Bestellung 256 Stücke: Lieferzeit 10-14 Tag (e) |
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