154764-E TE Connectivity Erni
Hersteller: TE Connectivity Erni
Description: SMC M RA B 26POS SMT
Packaging: Tape & Reel (TR)
Features: Board Guide, Solder Retention
Connector Type: Header
Current Rating (Amps): 1.7A per Contact
Mounting Type: Surface Mount, Right Angle
Number of Positions: 26
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.167" (4.25mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.157" (4.00mm)
| Anzahl | Preis |
|---|---|
| 560+ | 4.23 EUR |
| 1120+ | 4.03 EUR |
| 1680+ | 3.92 EUR |
| 2800+ | 3.78 EUR |
| 3920+ | 3.69 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 154764-E TE Connectivity Erni
Description: SMC M RA B 26POS SMT, Packaging: Tape & Reel (TR), Features: Board Guide, Solder Retention, Connector Type: Header, Current Rating (Amps): 1.7A per Contact, Mounting Type: Surface Mount, Right Angle, Number of Positions: 26, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Copper Alloy, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.167" (4.25mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.050" (1.27mm), Contact Length - Mating: 0.157" (4.00mm).
Weitere Produktangebote 154764-E nach Preis ab 3.43 EUR bis 6.62 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
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154764-E | TE Connectivity / ERNI |
Board to Board & Mezzanine Connectors 26P 1.27MM R/A MALE SMT DAUG CARD |
auf Bestellung 690 Stücke: Lieferzeit 10-14 Tag (e) |
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154764-E | TE Connectivity Erni |
Description: SMC M RA B 26POS SMT Features: Board Guide, Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Current Rating (Amps): 1.7A per Contact Mounting Type: Surface Mount, Right Angle Number of Positions: 26 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Alloy Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.167" (4.25mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.050" (1.27mm) Contact Length - Mating: 0.157" (4.00mm) |
auf Bestellung 6619 Stücke: Lieferzeit 10-14 Tag (e) |
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| 154764-E |
|
Hersteller: TE Connectivity / ERNI
Board to Board & Mezzanine Connectors 26P 1.27MM R/A MALE SMT DAUG CARD
Board to Board & Mezzanine Connectors 26P 1.27MM R/A MALE SMT DAUG CARD
auf Bestellung 690 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 5.46 EUR |
| 10+ | 4.65 EUR |
| 100+ | 3.94 EUR |
| 560+ | 3.77 EUR |
| 1120+ | 3.43 EUR |
| 154764-E |
|
Hersteller: TE Connectivity Erni
Description: SMC M RA B 26POS SMT
Features: Board Guide, Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header
Current Rating (Amps): 1.7A per Contact
Mounting Type: Surface Mount, Right Angle
Number of Positions: 26
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.167" (4.25mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.157" (4.00mm)
Description: SMC M RA B 26POS SMT
Features: Board Guide, Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header
Current Rating (Amps): 1.7A per Contact
Mounting Type: Surface Mount, Right Angle
Number of Positions: 26
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.167" (4.25mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.157" (4.00mm)
auf Bestellung 6619 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 6.62 EUR |
| 10+ | 5.62 EUR |
| 100+ | 4.78 EUR |