1571550-7 TE Connectivity AMP Connectors

Description: CONN IC DIP SOCKET 22POS TIN, Contact Material - Post: Beryllium Copper, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 22 (2 x 11), Operating Temperature: -55°C ~ 105°C, Type: DIP, 0.4" (10.16mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Tube.