16-350000-10-HT Aries Electronics
| Anzahl | Privatkunde |
|---|---|
| 5+ | 36.64 EUR |
| 6+ | 34.27 EUR |
| 24+ | 30.68 EUR |
| 48+ | 29.57 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
14-21 Tag (e)
Mindestmenge:
5 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details 16-350000-10-HT Aries Electronics
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3, Packaging: Bulk, Number of Pins: 16, Mounting Type: Through Hole, Material: FR4 Epoxy Glass, Number of Positions: 16, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm), Proto Board Type: DIP to DIP, Convert From (Adapter End): SOIC, Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing, Termination: Solder, Package Accepted: SOIC, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Tin, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Board Material: Polyimide (PI).
Weitere Produktangebote 16-350000-10-HT
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
 |
16-350000-10-HT | Aries Electronics |
 Description: SOCKET ADAPTER SOIC TO 16DIP 0.3Packaging: Bulk Number of Pins: 16 Mounting Type: Through Hole Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) Proto Board Type: DIP to DIP Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Termination: Solder Package Accepted: SOIC Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: Polyimide (PI) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 24 Stücke Im Einkaufswagen Stück im Wert von UAH |
 |
16-350000-10-HT | Aries Electronics |
IC & Component Sockets HITEMP SOIC DIP ADAP 16 PINS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 16-350000-10-HT |
|
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3
Packaging: Bulk
Number of Pins: 16
Mounting Type: Through Hole
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm)
Proto Board Type: DIP to DIP
Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Package Accepted: SOIC
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: Polyimide (PI)
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3
Packaging: Bulk
Number of Pins: 16
Mounting Type: Through Hole
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm)
Proto Board Type: DIP to DIP
Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Package Accepted: SOIC
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: Polyimide (PI)
Produkt ist nicht verfügbar
Mindestbestellmenge: 24 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 16-350000-10-HT |
|
Hersteller: Aries Electronics
IC & Component Sockets HITEMP SOIC DIP ADAP 16 PINS
IC & Component Sockets HITEMP SOIC DIP ADAP 16 PINS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH