16-350000-10-HT Aries Electronics
| Anzahl | Privatkunde |
|---|---|
| 5+ | 36.22 EUR |
| 6+ | 33.88 EUR |
| 24+ | 30.33 EUR |
| 48+ | 29.24 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 16-350000-10-HT Aries Electronics
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3, Material: FR4 Epoxy Glass, Package Accepted: SOIC, Proto Board Type: DIP to DIP, Board Thickness: 0.062" (1.57mm), Pitch: 0.050" (1.27mm), Number of Positions: 16, Board Material: Polyimide (PI), Contact Finish - Post: Tin-Lead, Pitch - Post: 0.100" (2.54mm), Contact Finish - Mating: Tin, Pitch - Mating: 0.050" (1.27mm), Termination: Solder, Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing, Convert From (Adapter End): SOIC, Mounting Type: Through Hole, Number of Pins: 16, Packaging: Bulk.
Weitere Produktangebote 16-350000-10-HT
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
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16-350000-10-HT | Aries Electronics |
 Description: SOCKET ADAPTER SOIC TO 16DIP 0.3Material: FR4 Epoxy Glass Package Accepted: SOIC Proto Board Type: DIP to DIP Board Thickness: 0.062" (1.57mm) Pitch: 0.050" (1.27mm) Number of Positions: 16 Board Material: Polyimide (PI) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Finish - Mating: Tin Pitch - Mating: 0.050" (1.27mm) Termination: Solder Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert From (Adapter End): SOIC Mounting Type: Through Hole Number of Pins: 16 Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 24 Stücke Im Einkaufswagen Stück im Wert von UAH |
 |
16-350000-10-HT | Aries Electronics |
IC & Component Sockets HITEMP SOIC DIP ADAP 16 PINS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 16-350000-10-HT |
|
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3
Material: FR4 Epoxy Glass
Package Accepted: SOIC
Proto Board Type: DIP to DIP
Board Thickness: 0.062" (1.57mm)
Pitch: 0.050" (1.27mm)
Number of Positions: 16
Board Material: Polyimide (PI)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert From (Adapter End): SOIC
Mounting Type: Through Hole
Number of Pins: 16
Packaging: Bulk
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3
Material: FR4 Epoxy Glass
Package Accepted: SOIC
Proto Board Type: DIP to DIP
Board Thickness: 0.062" (1.57mm)
Pitch: 0.050" (1.27mm)
Number of Positions: 16
Board Material: Polyimide (PI)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert From (Adapter End): SOIC
Mounting Type: Through Hole
Number of Pins: 16
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 24 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 16-350000-10-HT |
|
Hersteller: Aries Electronics
IC & Component Sockets HITEMP SOIC DIP ADAP 16 PINS
IC & Component Sockets HITEMP SOIC DIP ADAP 16 PINS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH