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16-3518-00

16-3518-00 Aries Electronics

12018-open-frame-surface-mount-collet-socket.pdf
Hersteller: Aries Electronics
IC & Component Sockets SURFACE MOUNT 16 PIN
auf Bestellung 128 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+8.82 EUR
10+8.04 EUR
25+7.6 EUR
100+7.08 EUR
250+6.18 EUR
500+6.01 EUR
1000+5.11 EUR
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Technische Details 16-3518-00 Aries Electronics

Description: CONN IC DIP SOCKET 16POS GOLD, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 16 (2 x 8), Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Surface Mount, Features: Open Frame, Packaging: Bulk.

Weitere Produktangebote 16-3518-00

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
16-3518-00 Aries Electronics 12018-open-frame-surface-mount-collet-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
 Mindestbestellmenge: 199 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
16-3518-00 12018-open-frame-surface-mount-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 199 Stücke
Im Einkaufswagen  Stück im Wert von  UAH