16-3518-10T Aries Electronics
auf Bestellung 51 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 2.16 EUR |
| 10+ | 1.64 EUR |
| 24+ | 1.48 EUR |
| 120+ | 1.42 EUR |
| 264+ | 1.32 EUR |
| 504+ | 1.25 EUR |
| 1008+ | 1.17 EUR |
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Technische Details 16-3518-10T Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD, Packaging: Bulk, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 16-3518-10T nach Preis ab 1.46 EUR bis 2.16 EUR
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16-3518-10T | Hersteller : Aries Electronics |
 Description: CONN IC DIP SOCKET 16POS GOLDPackaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 414 Stücke: Lieferzeit 10-14 Tag (e) |
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