16-810-90C Aries Electronics

Description: CONN IC DIP SOCKET 16POS GOLD, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 16 (2 x 8), Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Right Angle, Vertical, Features: Closed Frame, Packaging: Bulk, Part Status: Active, Contact Material - Post: Brass.