16-C280-10 Aries Electronics
| Anzahl | Preis |
|---|---|
| 2+ | 7.6 EUR |
| 10+ | 6.39 EUR |
| 100+ | 6.07 EUR |
| 250+ | 5.1 EUR |
| 500+ | 4.95 EUR |
| 1000+ | 4.31 EUR |
| 2500+ | 4.1 EUR |
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Technische Details 16-C280-10 Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD, Part Status: Active, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Features: Closed Frame, Packaging: Bulk, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 16 (2 x 8), Operating Temperature: -55°C ~ 105°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole.
Weitere Produktangebote 16-C280-10 nach Preis ab 5.52 EUR bis 7.64 EUR
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16-C280-10 | Hersteller : Aries Electronics |
 Description: CONN IC DIP SOCKET 16POS GOLDPart Status: Active Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Features: Closed Frame Packaging: Bulk Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 16 (2 x 8) Operating Temperature: -55°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole |
auf Bestellung 182 Stücke: Lieferzeit 10-14 Tag (e) |
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