Technische Details 171597-0008 Molex
Description: MEGA-FIT HEADER ASSEMBLY VERTICA, Features: Board Guide, Packaging: Bulk, Connector Type: Header, Mounting Type: Through Hole, Number of Positions: 10, Number of Rows: 2, Style: Board to Cable/Wire, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Copper, Insulation Color: Black, Pitch - Mating: 0.224" (5.70mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Post: Tin, Contact Shape: Square, Contact Length - Post: 0.147" (3.73mm), Insulation Height: 0.583" (14.80mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.224" (5.70mm).
Weitere Produktangebote 171597-0008 nach Preis ab 16.3 EUR bis 16.3 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
| 171597-0008 | Molex | Description: MEGA-FIT HEADER ASSEMBLY VERTICA |
auf Bestellung 640 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 171597-0008 |
Hersteller: Molex
Description: MEGA-FIT HEADER ASSEMBLY VERTICA
Description: MEGA-FIT HEADER ASSEMBLY VERTICA
auf Bestellung 640 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 16.3 EUR |

