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Technische Details 171597-0008 Molex
Description: MEGA-FIT HEADER ASSEMBLY VERTICA, Features: Board Guide, Packaging: Bulk, Connector Type: Header, Mounting Type: Through Hole, Number of Positions: 10, Number of Rows: 2, Style: Board to Cable/Wire, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Copper, Insulation Color: Black, Pitch - Mating: 0.224" (5.70mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Post: Tin, Contact Shape: Square, Contact Length - Post: 0.147" (3.73mm), Insulation Height: 0.583" (14.80mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.224" (5.70mm).
Weitere Produktangebote 171597-0008
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| 1715970008 | Molex |
Description: MEGA-FIT HEADER ASSEMBLY VERTICA Features: Board Guide Packaging: Bulk Connector Type: Header Mounting Type: Through Hole Number of Positions: 10 Number of Rows: 2 Style: Board to Cable/Wire Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Insulation Color: Black Pitch - Mating: 0.224" (5.70mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Tin Contact Shape: Square Contact Length - Post: 0.147" (3.73mm) Insulation Height: 0.583" (14.80mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.224" (5.70mm) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 1715970008 |
Hersteller: Molex
Description: MEGA-FIT HEADER ASSEMBLY VERTICA
Features: Board Guide
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 10
Number of Rows: 2
Style: Board to Cable/Wire
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper
Insulation Color: Black
Pitch - Mating: 0.224" (5.70mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.147" (3.73mm)
Insulation Height: 0.583" (14.80mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.224" (5.70mm)
Description: MEGA-FIT HEADER ASSEMBLY VERTICA
Features: Board Guide
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 10
Number of Rows: 2
Style: Board to Cable/Wire
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper
Insulation Color: Black
Pitch - Mating: 0.224" (5.70mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.147" (3.73mm)
Insulation Height: 0.583" (14.80mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.224" (5.70mm)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
