18-3518-10 Aries Electronics
| Anzahl | Privatkunde |
|---|---|
| 1+ | 3.88 EUR |
| 10+ | 3.17 EUR |
| 110+ | 2.73 EUR |
| 506+ | 2.49 EUR |
| 1012+ | 2.14 EUR |
| 2508+ | 2.01 EUR |
| 5016+ | 1.92 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 18-3518-10 Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 18 (2 x 9), Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Packaging: Tube.
Weitere Produktangebote 18-3518-10 nach Preis ab 2.81 EUR bis 4.38 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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18-3518-10 | Aries Electronics |
 Description: CONN IC DIP SOCKET 18POS GOLDContact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 18 (2 x 9) Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Packaging: Tube |
auf Bestellung 254 Stücke: Lieferzeit 10-14 Tag (e) |
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18-3518-10 | ARIES |
Description: ARIES - 18-3518-10 - IC- & Baustein-Sockel, 18 Kontakt(e), DIP, 2.54 mm, 518, 7.62 mm, Berylliumkupfer tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Berylliumkupfer isCanonical: Y Anzahl der Kontakte: 18Kontakt(e) Reihenabstand: 7.62mm Steckverbinder: DIP Produktpalette: 518 productTraceability: No usEccn: EAR99 Rastermaß: 2.54mm |
auf Bestellung 576 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| 18-3518-10 | Aries Electronics |
Conn DIP Socket SKT 18 POS 2.54mm Solder ST Thru-Hole |
auf Bestellung 462 Stücke: Lieferzeit 14-21 Tag (e) |
|
| 18-3518-10 |
|
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Packaging: Tube
Description: CONN IC DIP SOCKET 18POS GOLD
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Packaging: Tube
auf Bestellung 254 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 3.92 EUR |
| 22+ | 3.15 EUR |
| 44+ | 3 EUR |
| 66+ | 2.92 EUR |
| 110+ | 2.81 EUR |
| 18-3518-10 |
|
Hersteller: ARIES
Description: ARIES - 18-3518-10 - IC- & Baustein-Sockel, 18 Kontakt(e), DIP, 2.54 mm, 518, 7.62 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 18Kontakt(e)
Reihenabstand: 7.62mm
Steckverbinder: DIP
Produktpalette: 518
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
Description: ARIES - 18-3518-10 - IC- & Baustein-Sockel, 18 Kontakt(e), DIP, 2.54 mm, 518, 7.62 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 18Kontakt(e)
Reihenabstand: 7.62mm
Steckverbinder: DIP
Produktpalette: 518
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
auf Bestellung 576 Stücke:
Lieferzeit 14-21 Tag (e)
| 18-3518-10 |
|
Hersteller: Aries Electronics
Conn DIP Socket SKT 18 POS 2.54mm Solder ST Thru-Hole
Conn DIP Socket SKT 18 POS 2.54mm Solder ST Thru-Hole
auf Bestellung 462 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 44+ | 4.38 EUR |
| 110+ | 3.74 EUR |
| 264+ | 3.36 EUR |