18-6810-90T Aries Electronics
| Anzahl | Privatkunde |
|---|---|
| 1+ | 28.25 EUR |
| 10+ | 24 EUR |
| 25+ | 22.49 EUR |
| 50+ | 21.42 EUR |
| 100+ | 19.81 EUR |
| 250+ | 18.62 EUR |
| 500+ | 18.08 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 18-6810-90T Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Termination: Solder, Number of Positions or Pins (Grid): 18 (2 x 9), Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Right Angle, Vertical, Features: Closed Frame, Packaging: Bulk, Part Status: Active, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Phosphor Bronze.
Weitere Produktangebote 18-6810-90T nach Preis ab 24.37 EUR bis 29.79 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
18-6810-90T | Aries Electronics |
 Description: CONN IC DIP SOCKET 18POS TINContact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6 Termination: Solder Number of Positions or Pins (Grid): 18 (2 x 9) Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole, Right Angle, Vertical Features: Closed Frame Packaging: Bulk Part Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze |
auf Bestellung 94 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 18-6810-90T |
|
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Vertical
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Description: CONN IC DIP SOCKET 18POS TIN
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Vertical
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
auf Bestellung 94 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 29.79 EUR |
| 10+ | 26.39 EUR |
| 25+ | 25.38 EUR |
| 50+ | 24.37 EUR |