18-6810-90T Aries Electronics
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 22.21 EUR |
| 10+ | 18.87 EUR |
| 25+ | 17.69 EUR |
| 50+ | 16.84 EUR |
| 100+ | 16.03 EUR |
| 250+ | 15.03 EUR |
| 500+ | 14.31 EUR |
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Technische Details 18-6810-90T Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Right Angle, Vertical, Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Phosphor Bronze, Part Status: Active.
Weitere Produktangebote 18-6810-90T nach Preis ab 20.48 EUR bis 25.03 EUR
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18-6810-90T | Hersteller : Aries Electronics |
 Description: CONN IC DIP SOCKET 18POS TINPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 94 Stücke: Lieferzeit 10-14 Tag (e) |
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