Technische Details 1814640-8 TE Connectivity
Description: CONN IC DIP SOCKET 8POS TIN, Packaging: Tube, Features: Open Frame, Mounting Type: Surface Mount, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Thermoplastic, Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass.
Weitere Produktangebote 1814640-8 nach Preis ab 2.32 EUR bis 2.77 EUR
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| 1814640-8 | Hersteller : TE Connectivity |
 Category: Semiconductors - accessories - Unclass.Description: 1814640-8 |
auf Bestellung 1632 Stücke: Lieferzeit 14-21 Tag (e) |
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1814640-8 | Hersteller : TE Connectivity |
Conn DIP Socket SKT 8 POS 2.54mm Solder ST SMD Box/Tube |
Produkt ist nicht verfügbar |
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1814640-8 | Hersteller : TE Connectivity AMP Connectors |
Description: CONN IC DIP SOCKET 8POS TIN Packaging: Tube Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |