1825093-4 TE Connectivity
| Anzahl | Privatkunde |
|---|---|
| 157+ | 1.13 EUR |
| 550+ | 1.07 EUR |
| 1100+ | 1.04 EUR |
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Technische Details 1825093-4 TE Connectivity
Description: CONN IC DIP SOCKET 16POS GOLD, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 15.0µin (0.38µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Phosphor Bronze, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Thermoplastic, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 16 (2 x 8), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Tube.
Weitere Produktangebote 1825093-4
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
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1825093-4 | TE Connectivity AMP Connectors |
Description: CONN IC DIP SOCKET 16POS GOLDContact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 15.0µin (0.38µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Thermoplastic, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 16 (2 x 8) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 1825093-4 |
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Hersteller: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 16POS GOLD
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 15.0µin (0.38µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Thermoplastic, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 16POS GOLD
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 15.0µin (0.38µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Thermoplastic, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH



