1825108-3 TE Connectivity AMP Connectors
Hersteller: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Thermoplastic, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 15.0µin (0.38µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Thermoplastic, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 15.0µin (0.38µm)
Contact Material - Post: Phosphor Bronze
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
4+ | 4.51 EUR |
Produktrezensionen
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Technische Details 1825108-3 TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 40POS GOLD, Features: Closed Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 40 (2 x 20), Termination: Solder, Housing Material: Thermoplastic, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 15.0µin (0.38µm), Contact Material - Post: Phosphor Bronze.
Weitere Produktangebote 1825108-3
Foto | Bezeichnung | Hersteller | Beschreibung |
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1825108-3 | Hersteller : TE Connectivity |
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Produkt ist nicht verfügbar |
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1825108-3 | Hersteller : TE Connectivity AMP Connectors |
Description: CONN IC DIP SOCKET 40POS GOLD Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Thermoplastic, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 15.0µin (0.38µm) Contact Material - Post: Phosphor Bronze |
Produkt ist nicht verfügbar |