1MM-HU-D06-VS-00-H-TBP TE Connectivity
Hersteller: TE ConnectivityBoard to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 012 SMT G3 TBK
auf Bestellung 1546 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 4.89 EUR |
| 10+ | 4.72 EUR |
| 25+ | 4.47 EUR |
| 50+ | 4.36 EUR |
| 80+ | 3.41 EUR |
| 240+ | 3.4 EUR |
| 560+ | 3.12 EUR |
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Technische Details 1MM-HU-D06-VS-00-H-TBP TE Connectivity
Description: SCL 1.0 HDR DRVT USP 012 SMT G3, Features: Pick and Place, Packaging: Box, Connector Type: Header, Breakaway, Voltage Rating: 30VAC, Current Rating (Amps): 1A, Mounting Type: Surface Mount, Number of Positions: 12, Number of Rows: 2, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.059" (1.50mm), Shrouding: Unshrouded, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.039" (1.00mm), Contact Length - Mating: 0.083" (2.10mm).
Weitere Produktangebote 1MM-HU-D06-VS-00-H-TBP nach Preis ab 2.99 EUR bis 4.89 EUR
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1MM-HU-D06-VS-00-H-TBP | Hersteller : TE Connectivity AMP Connectors |
Description: SCL 1.0 HDR DRVT USP 012 SMT G3 Features: Pick and Place Packaging: Box Connector Type: Header, Breakaway Voltage Rating: 30VAC Current Rating (Amps): 1A Mounting Type: Surface Mount Number of Positions: 12 Number of Rows: 2 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.059" (1.50mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.039" (1.00mm) Contact Length - Mating: 0.083" (2.10mm) |
auf Bestellung 1050 Stücke: Lieferzeit 10-14 Tag (e) |
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1MM-HU-D06-VS-00-H-TBP | Hersteller : TE CONNECTIVITY |
Description: TE CONNECTIVITY - 1MM-HU-D06-VS-00-H-TBP - Stiftleiste, Board-to-Board, 1 mm, 2 Reihe(n), 12 Kontakt(e), Oberflächenmontage, gerade tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze usEccn: EAR99 Steckverbinderkragen: Ohne Kragen Anzahl der Kontakte: 12Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Steckverbinder: Stiftleiste Produktpalette: Ampmodu Small Centerline productTraceability: No Kontaktanschluss: Oberflächenmontage, gerade Anzahl der Reihen: 2Reihe(n) Rastermaß: 1mm SVHC: No SVHC (21-Jan-2025) |
auf Bestellung 610 Stücke: Lieferzeit 14-21 Tag (e) |