2-640463-2 TE Connectivity
auf Bestellung 940 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 76+ | 1.97 EUR |
| 300+ | 1.81 EUR |
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Technische Details 2-640463-2 TE Connectivity
Description: CONN IC DIP SOCKET 8POS GOLD, Packaging: Tube, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Thermoplastic, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper.
Weitere Produktangebote 2-640463-2
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| 2-640463-2 | Hersteller : TE Connectivity |
 26404632-TEC-0 Semiconductors - accessories - Unclass. |
Produkt ist nicht verfügbar |
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2-640463-2 | Hersteller : TE Connectivity AMP Connectors |
Description: CONN IC DIP SOCKET 8POS GOLD Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Thermoplastic, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |