
2-641606-2 TE Connectivity
auf Bestellung 40 Stücke:
Lieferzeit 14-21 Tag (e)
Anzahl | Preis |
---|---|
10+ | 15.05 EUR |
30+ | 11.72 EUR |
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Technische Details 2-641606-2 TE Connectivity
Description: CONN IC DIP SOCKET 40POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 40 (2 x 20), Termination: Solder, Housing Material: Thermoplastic, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper.
Weitere Produktangebote 2-641606-2
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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2-641606-2 | Hersteller : TE CONNECTIVITY / PARTNER STOCK |
![]() tariffCode: 85366990 productTraceability: No rohsCompliant: NO euEccn: NLR hazardous: false rohsPhthalatesCompliant: NO usEccn: EAR99 SVHC: No SVHC (14-Jun-2023) |
auf Bestellung 1904 Stücke: Lieferzeit 14-21 Tag (e) |
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2-641606-2 | Hersteller : TE Connectivity |
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Produkt ist nicht verfügbar |
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2-641606-2 | Hersteller : TE Connectivity AMP Connectors |
![]() Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Thermoplastic, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
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2-641606-2 | Hersteller : TE Connectivity / AMP |
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Produkt ist nicht verfügbar |