20-0511-10 Aries Electronics
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 20POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
| Anzahl | Preis |
|---|---|
| 2+ | 8.87 EUR |
| 10+ | 7.24 EUR |
| 100+ | 5.9 EUR |
| 500+ | 5.12 EUR |
| 1000+ | 4.91 EUR |
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Technische Details 20-0511-10 Aries Electronics
Description: CONN SOCKET SIP 20POS TIN, Packaging: Bulk, Mounting Type: Through Hole, Type: SIP, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 20 (1 x 20), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 50.0µin (1.27µm), Contact Material - Post: Phosphor Bronze, Part Status: Active.
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