200-6313-9UN-1900 3M Electronic Solutions Division
auf Bestellung 29 Stücke:
Lieferzeit 86-90 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 115.32 EUR |
| 5+ | 111.9 EUR |
| 10+ | 108.52 EUR |
| 20+ | 105.12 EUR |
Produktrezensionen
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Technische Details 200-6313-9UN-1900 3M Electronic Solutions Division
Description: CONN SOCKET PGA ZIF 169POS GOLD, Packaging: Bulk, Mounting Type: Through Hole, Type: PGA, ZIF (ZIP), Operating Temperature: -55°C ~ 150°C, Number of Positions or Pins (Grid): 169 (13 x 13), Termination: Solder, Housing Material: Polyethersulfone (PES), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Obsolete.
Weitere Produktangebote 200-6313-9UN-1900
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| 200-6313-9UN-1900 | Hersteller : 3M Interconnect Solutions |
 Connector Accessories Kit Straight Polyethersyfone Black Box |
Produkt ist nicht verfügbar |
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200-6313-9UN-1900 | Hersteller : 3M Interconnect Solutions |
Connector Accessories Kit Straight Polyethersyfone Black Box |
Produkt ist nicht verfügbar |
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200-6313-9UN-1900 | Hersteller : 3M Interconnect Solutions |
Connector Accessories Kit Straight Polyethersyfone Black Box |
Produkt ist nicht verfügbar |
|
 |
200-6313-9UN-1900 | Hersteller : 3M |
Description: CONN SOCKET PGA ZIF 169POS GOLD Packaging: Bulk Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Operating Temperature: -55°C ~ 150°C Number of Positions or Pins (Grid): 169 (13 x 13) Termination: Solder Housing Material: Polyethersulfone (PES) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Obsolete |
Produkt ist nicht verfügbar |