200-6313-9UN-1900 3M Electronic Solutions Division

Description: CONN SOCKET PGA ZIF 169POS GOLD, Part Status: Obsolete, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyethersulfone (PES), Termination: Solder, Number of Positions or Pins (Grid): 169 (13 x 13), Mounting Type: Through Hole, Packaging: Bulk, Operating Temperature: -55°C ~ 150°C, Type: PGA, ZIF (ZIP).