200-6325-9UN-1900 3M Electronic Solutions Division

Description: CONN SOCKET PGA ZIF 625POS GOLD, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyethersulfone (PES), Termination: Solder, Number of Positions or Pins (Grid): 625 (25 x 25), Operating Temperature: -55°C ~ 150°C, Type: PGA, ZIF (ZIP), Mounting Type: Through Hole, Packaging: Bulk, Part Status: Obsolete, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper.