Technische Details 2013012-3 TE Connectivity
Description: CONN RCPT 50POS SMD GOLD, Number of Rows: 2, Part Status: Active, Mated Stacking Heights: 4mm, Contact Finish Thickness: 30.0µin (0.76µm), Height Above Board: 0.128" (3.25mm), Pitch: 0.024" (0.60mm), Number of Positions: 50, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Receptacle, Center Strip Contacts, Features: Board Guide, Solder Retention, Packaging: Tray.
Weitere Produktangebote 2013012-3
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2013012-3 | Hersteller : TE Connectivity AMP Connectors |
 Description: CONN RCPT 50POS SMD GOLDNumber of Rows: 2 Part Status: Active Mated Stacking Heights: 4mm Contact Finish Thickness: 30.0µin (0.76µm) Height Above Board: 0.128" (3.25mm) Pitch: 0.024" (0.60mm) Number of Positions: 50 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Board Guide, Solder Retention Packaging: Tray |
Produkt ist nicht verfügbar |
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| 2013012-3 | Hersteller : TE Connectivity |
Board to Board & Mezzanine Connectors .6FHR04H,050,S,STD, 30/SP,ST,NSYes |
Produkt ist nicht verfügbar |