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208-PRS17017-12

208-PRS17017-12 Aries Electronics

Aries_10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
IC & Component Sockets
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+361.56 EUR
10+334.81 EUR
25+333.97 EUR
50+332.46 EUR
Im Einkaufswagen  Stück im Wert von  UAH
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Technische Details 208-PRS17017-12 Aries Electronics

Description: CONN SOCKET PGA ZIF GOLD, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Termination: Solder, Operating Temperature: -65°C ~ 125°C, Type: PGA, ZIF (ZIP), Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.

Weitere Produktangebote 208-PRS17017-12

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
208-PRS17017-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS)
Termination: Solder
Operating Temperature: -65°C ~ 125°C
Type: PGA, ZIF (ZIP)
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Produkt ist nicht verfügbar
 Mindestbestellmenge: 4 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
208-PRS17017-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS)
Termination: Solder
Operating Temperature: -65°C ~ 125°C
Type: PGA, ZIF (ZIP)
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 4 Stücke
Im Einkaufswagen  Stück im Wert von  UAH