209-PGM17030-11 Aries Electronics
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
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Technische Details 209-PGM17030-11 Aries Electronics
Description: CONN SOCKET PGA GOLD, Operating Temperature: -55°C ~ 125°C, Type: PGA, Mounting Type: Through Hole, Packaging: Bulk, Part Status: Active, Contact Material - Post: Brass, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder.
Weitere Produktangebote 209-PGM17030-11
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| 209-PGM17030-11 | Hersteller : Aries Electronics |
IC & Component Sockets PIN GRID ARRAY SOLDER TAIL 209 PINS |
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