2102060-2 TE Connectivity
Hersteller: TE Connectivity
Conn High Speed Mezzanine HDR 114 POS 1.27mm Solder Ball ST SMD VITA 61 T/R
| Anzahl | Preis |
|---|---|
| 5+ | 57.33 EUR |
| 10+ | 55.41 EUR |
| 25+ | 53.14 EUR |
| 50+ | 51.44 EUR |
| 230+ | 46.21 EUR |
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Technische Details 2102060-2 TE Connectivity
Description: CONN HEADER SMD 114POS 1.27MM, Row Spacing - Mating: 0.050" (1.27mm), Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Shrouded - 4 Wall, Insulation Height: 0.360" (9.14mm), Contact Shape: Square, Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Natural, Contact Material: Phosphor Bronze, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin, Style: Board to Board, Number of Rows: 6, Number of Positions: 114, Mounting Type: Surface Mount, Connector Type: Header, Features: Pick and Place, Packaging: Tape & Reel (TR).
Weitere Produktangebote 2102060-2 nach Preis ab 64.5 EUR bis 93.58 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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2102060-2 | Hersteller : TE Connectivity / Raychem |
Board to Board & Mezzanine Connectors 114P Plug Lead-Free 1.27 Gold |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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2102060-2 | Hersteller : TE Connectivity |
Conn High Speed Mezzanine HDR 114 POS 1.27mm Solder Ball ST SMD VITA 61 T/R |
auf Bestellung 460 Stücke: Lieferzeit 14-21 Tag (e) |
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2102060-2 | Hersteller : TE Connectivity |
Conn High Speed Mezzanine HDR 114 POS 1.27mm Solder Ball ST SMD VITA 61 T/R |
auf Bestellung 460 Stücke: Lieferzeit 14-21 Tag (e) |
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2102060-2 | Hersteller : TE Connectivity Aerospace, Defense and Marine |
Description: CONN HEADER SMD 114POS 1.27MMFeatures: Pick and Place Packaging: Cut Tape (CT) Connector Type: Header Mounting Type: Surface Mount Number of Positions: 114 Number of Rows: 6 Style: Board to Board Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.360" (9.14mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.050" (1.27mm) |
auf Bestellung 185 Stücke: Lieferzeit 10-14 Tag (e) |
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2102060-2 | Hersteller : TE CONNECTIVITY - AMP |
Description: TE CONNECTIVITY - AMP - 2102060-2 - Stapelbare Leiterplattensteckverbinder, Mezalok, 114 Kontakt(e), Stiftleiste, 1.27 mmtariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y Ausführung: Stiftleiste usEccn: EAR99 Anzahl der Kontakte: 114Kontakt(e) euEccn: NLR Produktpalette: Mezalok productTraceability: Yes-Date/Lot Code Kontaktanschluss: Oberflächenmontage Anzahl der Reihen: 6Reihe(n) Rastermaß: 1.27mm SVHC: No SVHC (04-Feb-2026) |
auf Bestellung 129 Stücke: Lieferzeit 14-21 Tag (e) |



