2102060-2 TE Connectivity
Hersteller: TE Connectivity
Conn High Speed Mezzanine HDR 114 POS 1.27mm Solder Ball ST SMD VITA 61 T/R
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Technische Details 2102060-2 TE Connectivity
Description: CONN HEADER SMD 114POS 1.27MM, Row Spacing - Mating: 0.050" (1.27mm), Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Shrouded - 4 Wall, Insulation Height: 0.360" (9.14mm), Contact Shape: Square, Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Natural, Contact Material: Phosphor Bronze, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin, Style: Board to Board, Number of Rows: 6, Number of Positions: 114, Mounting Type: Surface Mount, Connector Type: Header, Features: Pick and Place, Packaging: Tape & Reel (TR).
Weitere Produktangebote 2102060-2 nach Preis ab 87.39 EUR bis 127.76 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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2102060-2 | TE Connectivity |
Conn High Speed Mezzanine HDR 114 POS 1.27mm Solder Ball ST SMD VITA 61 T/R |
auf Bestellung 410 Stücke: Lieferzeit 14-21 Tag (e) |
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2102060-2 | TE Connectivity Aerospace, Defense and Marine |
Description: CONN HEADER SMD 114POS 1.27MMRow Spacing - Mating: 0.050" (1.27mm) Insulation Material: Liquid Crystal Polymer (LCP) Shrouding: Shrouded - 4 Wall Insulation Height: 0.360" (9.14mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Finish - Mating: Gold Pitch - Mating: 0.050" (1.27mm) Insulation Color: Natural Contact Material: Phosphor Bronze Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Male Pin Style: Board to Board Number of Rows: 6 Number of Positions: 114 Mounting Type: Surface Mount Connector Type: Header Features: Pick and Place Packaging: Tape & Reel (TR) |
auf Bestellung 3220 Stücke: Lieferzeit 10-14 Tag (e) |
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2102060-2 | TE Connectivity |
Conn High Speed Mezzanine HDR 114 POS 1.27mm Solder Ball ST SMD VITA 61 T/R |
auf Bestellung 170 Stücke: Lieferzeit 14-21 Tag (e) |
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2102060-2 | TE Connectivity / Raychem |
Board to Board & Mezzanine Connectors 114P Plug Lead-Free 1.27 Gold |
auf Bestellung 1588 Stücke: Lieferzeit 10-14 Tag (e) |
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2102060-2 | TE Connectivity Aerospace, Defense and Marine |
Description: CONN HEADER SMD 114POS 1.27MMFeatures: Pick and Place Packaging: Cut Tape (CT) Connector Type: Header Mounting Type: Surface Mount Number of Positions: 114 Number of Rows: 6 Style: Board to Board Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.360" (9.14mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.050" (1.27mm) |
auf Bestellung 3577 Stücke: Lieferzeit 10-14 Tag (e) |
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2102060-2 | TE CONNECTIVITY - AMP |
Description: TE CONNECTIVITY - AMP - 2102060-2 - Stapelbare Leiterplattensteckverbinder, Mezalok, 114 Kontakt(e), Stiftleiste, 1.27 mmtariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y Ausführung: Stiftleiste Anzahl der Kontakte: 114Kontakt(e) SVHC: No SVHC (04-Feb-2026) Produktpalette: Mezalok productTraceability: Yes-Date/Lot Code Kontaktanschluss: Oberflächenmontage usEccn: EAR99 Anzahl der Reihen: 6Reihe(n) Rastermaß: 1.27mm |
auf Bestellung 104 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| 2102060-2 |
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Hersteller: TE Connectivity
Conn High Speed Mezzanine HDR 114 POS 1.27mm Solder Ball ST SMD VITA 61 T/R
Conn High Speed Mezzanine HDR 114 POS 1.27mm Solder Ball ST SMD VITA 61 T/R
auf Bestellung 410 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 87.39 EUR |
| 2102060-2 |
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Hersteller: TE Connectivity Aerospace, Defense and Marine
Description: CONN HEADER SMD 114POS 1.27MM
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.360" (9.14mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Natural
Contact Material: Phosphor Bronze
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Style: Board to Board
Number of Rows: 6
Number of Positions: 114
Mounting Type: Surface Mount
Connector Type: Header
Features: Pick and Place
Packaging: Tape & Reel (TR)
Description: CONN HEADER SMD 114POS 1.27MM
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.360" (9.14mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Natural
Contact Material: Phosphor Bronze
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Style: Board to Board
Number of Rows: 6
Number of Positions: 114
Mounting Type: Surface Mount
Connector Type: Header
Features: Pick and Place
Packaging: Tape & Reel (TR)
auf Bestellung 3220 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 230+ | 87.98 EUR |
| 2102060-2 |
![]() |
Hersteller: TE Connectivity
Conn High Speed Mezzanine HDR 114 POS 1.27mm Solder Ball ST SMD VITA 61 T/R
Conn High Speed Mezzanine HDR 114 POS 1.27mm Solder Ball ST SMD VITA 61 T/R
auf Bestellung 170 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 102.89 EUR |
| 10+ | 99.5 EUR |
| 25+ | 95.2 EUR |
| 50+ | 92.15 EUR |
| 2102060-2 |
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Hersteller: TE Connectivity / Raychem
Board to Board & Mezzanine Connectors 114P Plug Lead-Free 1.27 Gold
Board to Board & Mezzanine Connectors 114P Plug Lead-Free 1.27 Gold
auf Bestellung 1588 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 115.41 EUR |
| 10+ | 113.75 EUR |
| 2102060-2 |
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Hersteller: TE Connectivity Aerospace, Defense and Marine
Description: CONN HEADER SMD 114POS 1.27MM
Features: Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 114
Number of Rows: 6
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.360" (9.14mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.050" (1.27mm)
Description: CONN HEADER SMD 114POS 1.27MM
Features: Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 114
Number of Rows: 6
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.360" (9.14mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.050" (1.27mm)
auf Bestellung 3577 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 127.76 EUR |
| 10+ | 108.6 EUR |
| 25+ | 107.68 EUR |
| 2102060-2 |
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Hersteller: TE CONNECTIVITY - AMP
Description: TE CONNECTIVITY - AMP - 2102060-2 - Stapelbare Leiterplattensteckverbinder, Mezalok, 114 Kontakt(e), Stiftleiste, 1.27 mm
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Ausführung: Stiftleiste
Anzahl der Kontakte: 114Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Produktpalette: Mezalok
productTraceability: Yes-Date/Lot Code
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 6Reihe(n)
Rastermaß: 1.27mm
Description: TE CONNECTIVITY - AMP - 2102060-2 - Stapelbare Leiterplattensteckverbinder, Mezalok, 114 Kontakt(e), Stiftleiste, 1.27 mm
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Ausführung: Stiftleiste
Anzahl der Kontakte: 114Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Produktpalette: Mezalok
productTraceability: Yes-Date/Lot Code
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 6Reihe(n)
Rastermaß: 1.27mm
auf Bestellung 104 Stücke:
Lieferzeit 14-21 Tag (e)




