2102060-3 AMP - TE CONNECTIVITY
Hersteller: AMP - TE CONNECTIVITY
Description: AMP - TE CONNECTIVITY - 2102060-3 - Mezzanine-Steckverbinder, Stiftleiste, 1.27 mm, 6 Reihe(n), 114 Kontakt(e)
tariffCode: 85366930
euEccn: NLR
rohsCompliant: NO
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: NO
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbindermontage: Oberflächenmontage, gerade
Anzahl der Kontakte: 114Kontakt(e)
SVHC: Lead (04-Feb-2026)
Produktpalette: Mezalok
productTraceability: Yes-Date/Lot Code
usEccn: EAR99
Anzahl der Reihen: 6Reihe(n)
Mezzanine-Steckverbinder: Stiftleiste
Rastermaß: 1.27mm
| Anzahl | Privatkunde |
|---|---|
| 2+ | 133.45 EUR |
| 5+ | 114.61 EUR |
| 10+ | 97.2 EUR |
| 25+ | 92.8 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 2102060-3 AMP - TE CONNECTIVITY
Description: CONN HEADER SMD 114POS 1.27MM, Insulation Color: Natural, Contact Material: Phosphor Bronze, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin, Style: Board to Board, Shrouding: Shrouded - 4 Wall, Insulation Height: 0.360" (9.14mm), Contact Shape: Square, Part Status: Active, Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Number of Rows: 6, Number of Positions: 114, Mounting Type: Surface Mount, Connector Type: Header, Features: Pick and Place, Packaging: Tape & Reel (TR), Row Spacing - Mating: 0.050" (1.27mm), Insulation Material: Liquid Crystal Polymer (LCP).
Weitere Produktangebote 2102060-3
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
 |
2102060-3 | TE Connectivity Aerospace, Defense and Marine |
Description: CONN HEADER SMD 114POS 1.27MM Connector Type: Header Features: Pick and Place Packaging: Cut Tape (CT) Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Male Pin Style: Board to Board Number of Rows: 6 Number of Positions: 114 Mounting Type: Surface Mount Row Spacing - Mating: 0.050" (1.27mm) Insulation Material: Liquid Crystal Polymer (LCP) Shrouding: Shrouded - 4 Wall Insulation Height: 0.360" (9.14mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin-Lead Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.050" (1.27mm) Insulation Color: Natural Contact Material: Phosphor Bronze Termination: Solder |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
|
2102060-3 | TE Connectivity Aerospace, Defense and Marine |
Description: CONN HEADER SMD 114POS 1.27MM Insulation Color: Natural Contact Material: Phosphor Bronze Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Male Pin Style: Board to Board Shrouding: Shrouded - 4 Wall Insulation Height: 0.360" (9.14mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin-Lead Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.050" (1.27mm) Number of Rows: 6 Number of Positions: 114 Mounting Type: Surface Mount Connector Type: Header Features: Pick and Place Packaging: Tape & Reel (TR) Row Spacing - Mating: 0.050" (1.27mm) Insulation Material: Liquid Crystal Polymer (LCP) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 230 Stücke Im Einkaufswagen Stück im Wert von UAH |
 |
2102060-3 | TE Connectivity / Raychem |
Board to Board & Mezzanine Connectors 114P Plug Tin-Lead .76 Gold |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
 |
2102060-3 | TE Connectivity |
Conn High Speed Mezzanine HDR 114 POS 1.27mm Solder Ball ST SMD VITA 61 T/R |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 230 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 2102060-3 |
|
Hersteller: TE Connectivity Aerospace, Defense and Marine
Description: CONN HEADER SMD 114POS 1.27MM
Connector Type: Header
Features: Pick and Place
Packaging: Cut Tape (CT)
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Style: Board to Board
Number of Rows: 6
Number of Positions: 114
Mounting Type: Surface Mount
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.360" (9.14mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Natural
Contact Material: Phosphor Bronze
Termination: Solder
Description: CONN HEADER SMD 114POS 1.27MM
Connector Type: Header
Features: Pick and Place
Packaging: Cut Tape (CT)
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Style: Board to Board
Number of Rows: 6
Number of Positions: 114
Mounting Type: Surface Mount
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.360" (9.14mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Natural
Contact Material: Phosphor Bronze
Termination: Solder
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 2102060-3 |
|
Hersteller: TE Connectivity Aerospace, Defense and Marine
Description: CONN HEADER SMD 114POS 1.27MM
Insulation Color: Natural
Contact Material: Phosphor Bronze
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Style: Board to Board
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.360" (9.14mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Number of Rows: 6
Number of Positions: 114
Mounting Type: Surface Mount
Connector Type: Header
Features: Pick and Place
Packaging: Tape & Reel (TR)
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Description: CONN HEADER SMD 114POS 1.27MM
Insulation Color: Natural
Contact Material: Phosphor Bronze
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Style: Board to Board
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.360" (9.14mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Number of Rows: 6
Number of Positions: 114
Mounting Type: Surface Mount
Connector Type: Header
Features: Pick and Place
Packaging: Tape & Reel (TR)
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Produkt ist nicht verfügbar
Mindestbestellmenge: 230 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 2102060-3 |
|
Hersteller: TE Connectivity / Raychem
Board to Board & Mezzanine Connectors 114P Plug Tin-Lead .76 Gold
Board to Board & Mezzanine Connectors 114P Plug Tin-Lead .76 Gold
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 2102060-3 |
|
Hersteller: TE Connectivity
Conn High Speed Mezzanine HDR 114 POS 1.27mm Solder Ball ST SMD VITA 61 T/R
Conn High Speed Mezzanine HDR 114 POS 1.27mm Solder Ball ST SMD VITA 61 T/R
Produkt ist nicht verfügbar
Mindestbestellmenge: 230 Stücke
Im Einkaufswagen
Stück im Wert von UAH