2102061-9 TE Connectivity
Hersteller: TE Connectivity
Conn High Speed Mezzanine RCP 114 POS 1.27mm Solder Ball ST SMD VITA 61 T/R
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Technische Details 2102061-9 TE Connectivity
Description: CONN RCPT 114POS 0.05 GOLD SMD, Features: Pick and Place, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Voltage Rating: 250VAC, Mounting Type: Surface Mount, Number of Positions: 114, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Mated Stacking Heights: 18mm, Insulation Color: Natural, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Finish - Post: Tin-Lead, Part Status: Active, Insulation Height: 0.551" (14.00mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 6.
Weitere Produktangebote 2102061-9
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
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2102061-9 | TE Connectivity Aerospace, Defense and Marine |
Description: CONN RCPT 114POS 0.05 GOLD SMD Number of Rows: 6 Row Spacing - Mating: 0.050" (1.27mm) Part Status: Active Contact Finish - Post: Tin-Lead Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Finish - Mating: Gold Pitch - Mating: 0.050" (1.27mm) Insulation Color: Natural Mated Stacking Heights: 18mm Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 114 Mounting Type: Surface Mount Voltage Rating: 250VAC Packaging: Cut Tape (CT) Insulation Height: 0.551" (14.00mm) Connector Type: Receptacle Features: Pick and Place |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
|
2102061-9 | TE Connectivity Aerospace, Defense and Marine |
Description: CONN RCPT 114POS 0.05 GOLD SMD Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Voltage Rating: 250VAC Mounting Type: Surface Mount Number of Positions: 114 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Mated Stacking Heights: 18mm Insulation Color: Natural Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Finish - Post: Tin-Lead Part Status: Active Insulation Height: 0.551" (14.00mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 6 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 100 Stücke Im Einkaufswagen Stück im Wert von UAH |
 |
2102061-9 | TE Connectivity / Raychem |
Board to Board & Mezzanine Connectors 114P Rcpt Tin-Lead 18MM 1.27 Gold |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
 |
2102061-9 | AMP - TE CONNECTIVITY |
Description: AMP - TE CONNECTIVITY - 2102061-9 - Mezzanine-Steckverbinder, Buchse, 1.27 mm, 6 Reihe(n), 114 Kontakt(e), Oberflächenmontage, gerade Kontaktüberzug: Vergoldete Kontakte Rastermaß: 1.27 Anzahl der Kontakte: 114 Mezzanine-Steckverbinder: Buchse Anzahl der Reihen: 6 Kontaktmaterial: Beryllium-Kupfer Steckverbindermontage: Oberflächenmontage, gerade Produktpalette: Mezalok SVHC: No SVHC (19-Jan-2021) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 100 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 2102061-9 |
|
Hersteller: TE Connectivity Aerospace, Defense and Marine
Description: CONN RCPT 114POS 0.05 GOLD SMD
Number of Rows: 6
Row Spacing - Mating: 0.050" (1.27mm)
Part Status: Active
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Natural
Mated Stacking Heights: 18mm
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 114
Mounting Type: Surface Mount
Voltage Rating: 250VAC
Packaging: Cut Tape (CT)
Insulation Height: 0.551" (14.00mm)
Connector Type: Receptacle
Features: Pick and Place
Description: CONN RCPT 114POS 0.05 GOLD SMD
Number of Rows: 6
Row Spacing - Mating: 0.050" (1.27mm)
Part Status: Active
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Natural
Mated Stacking Heights: 18mm
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 114
Mounting Type: Surface Mount
Voltage Rating: 250VAC
Packaging: Cut Tape (CT)
Insulation Height: 0.551" (14.00mm)
Connector Type: Receptacle
Features: Pick and Place
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 2102061-9 |
|
Hersteller: TE Connectivity Aerospace, Defense and Marine
Description: CONN RCPT 114POS 0.05 GOLD SMD
Features: Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Voltage Rating: 250VAC
Mounting Type: Surface Mount
Number of Positions: 114
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Mated Stacking Heights: 18mm
Insulation Color: Natural
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Insulation Height: 0.551" (14.00mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 6
Description: CONN RCPT 114POS 0.05 GOLD SMD
Features: Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Voltage Rating: 250VAC
Mounting Type: Surface Mount
Number of Positions: 114
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Mated Stacking Heights: 18mm
Insulation Color: Natural
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Insulation Height: 0.551" (14.00mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 6
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 2102061-9 |
|
Hersteller: TE Connectivity / Raychem
Board to Board & Mezzanine Connectors 114P Rcpt Tin-Lead 18MM 1.27 Gold
Board to Board & Mezzanine Connectors 114P Rcpt Tin-Lead 18MM 1.27 Gold
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 2102061-9 |
|
Hersteller: AMP - TE CONNECTIVITY
Description: AMP - TE CONNECTIVITY - 2102061-9 - Mezzanine-Steckverbinder, Buchse, 1.27 mm, 6 Reihe(n), 114 Kontakt(e), Oberflächenmontage, gerade
Kontaktüberzug: Vergoldete Kontakte
Rastermaß: 1.27
Anzahl der Kontakte: 114
Mezzanine-Steckverbinder: Buchse
Anzahl der Reihen: 6
Kontaktmaterial: Beryllium-Kupfer
Steckverbindermontage: Oberflächenmontage, gerade
Produktpalette: Mezalok
SVHC: No SVHC (19-Jan-2021)
Description: AMP - TE CONNECTIVITY - 2102061-9 - Mezzanine-Steckverbinder, Buchse, 1.27 mm, 6 Reihe(n), 114 Kontakt(e), Oberflächenmontage, gerade
Kontaktüberzug: Vergoldete Kontakte
Rastermaß: 1.27
Anzahl der Kontakte: 114
Mezzanine-Steckverbinder: Buchse
Anzahl der Reihen: 6
Kontaktmaterial: Beryllium-Kupfer
Steckverbindermontage: Oberflächenmontage, gerade
Produktpalette: Mezalok
SVHC: No SVHC (19-Jan-2021)
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
Im Einkaufswagen
Stück im Wert von UAH