213227-1670 Molex
auf Bestellung 982 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 10.37 EUR |
| 10+ | 8.82 EUR |
| 25+ | 7.73 EUR |
| 100+ | 7.3 EUR |
| 250+ | 7.16 EUR |
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Technische Details 213227-1670 Molex
Description: DRVT 1.5 SMT AU0.76 ETP 16P NAT, Features: Pick and Place, Solder Retention, Packaging: Bulk, Connector Type: Receptacle, Voltage Rating: 100VAC/DC, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Number of Positions: 16, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Forked, Fastening Type: Latch Holder, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Natural, Pitch - Mating: 0.059" (1.50mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.346" (8.80mm), Number of Rows: 2.
Weitere Produktangebote 213227-1670 nach Preis ab 7.71 EUR bis 13.22 EUR
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2132271670 | Hersteller : Molex |
 Description: DRVT 1.5 SMT AU0.76 ETP 16P NATFeatures: Pick and Place, Solder Retention Packaging: Bulk Connector Type: Receptacle Voltage Rating: 100VAC/DC Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 16 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Forked Fastening Type: Latch Holder Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Natural Pitch - Mating: 0.059" (1.50mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.346" (8.80mm) Number of Rows: 2 |
auf Bestellung 3207 Stücke: Lieferzeit 10-14 Tag (e) |
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| 2132271670 | Hersteller : Molex |
1.50mm Pitch CLIK Mate Wire to Board PCB Receptacle Dual Row Surface Mount Vertical 0.76um Gold Au Plating 16 Circuits Natural |
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