214-44-308-01-670800 Mill-Max
| Anzahl | Privatkunde |
|---|---|
| 2+ | 1.95 EUR |
| 10+ | 1.55 EUR |
| 50+ | 1.48 EUR |
| 100+ | 1.4 EUR |
| 250+ | 1.31 EUR |
| 500+ | 1.25 EUR |
| 1000+ | 1.19 EUR |
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Technische Details 214-44-308-01-670800 Mill-Max
Description: CONN IC DIP SOCKET 8POS TIN, Packaging: Tube, Features: Closed Frame, Mounting Type: Surface Mount, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy, Part Status: Active.
Weitere Produktangebote 214-44-308-01-670800 nach Preis ab 1.11 EUR bis 1.95 EUR
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214-44-308-01-670800 | Mill-Max Manufacturing Corp. |
 Description: CONN IC DIP SOCKET 8POS TINPackaging: Tube Features: Closed Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
auf Bestellung 51724 Stücke: Lieferzeit 10-14 Tag (e) |
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| 214-44-308-01-670800 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 8POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 51724 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 11+ | 1.95 EUR |
| 13+ | 1.64 EUR |
| 25+ | 1.54 EUR |
| 50+ | 1.46 EUR |
| 100+ | 1.39 EUR |
| 250+ | 1.31 EUR |
| 500+ | 1.25 EUR |
| 1000+ | 1.19 EUR |
| 2500+ | 1.11 EUR |