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214-44-624-01-670800

214-44-624-01-670800 Mill-Max


MMMC_S_A0004813566_1-2556695.pdf Hersteller: Mill-Max
IC & Component Sockets 24 PIN Sn/Sn SMT CLOSED FRAME
auf Bestellung 203 Stücke:

Lieferzeit 14-28 Tag (e)
Anzahl Preis ohne MwSt
8+7.2 EUR
112+ 5.49 EUR
256+ 5.41 EUR
512+ 5.1 EUR
1008+ 4.73 EUR
2512+ 4.58 EUR
5008+ 4.5 EUR
Mindestbestellmenge: 8
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Technische Details 214-44-624-01-670800 Mill-Max

Description: CONN IC DIP SOCKET 24POS TIN, Packaging: Tube, Features: Closed Frame, Mounting Type: Surface Mount, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy, Part Status: Active.

Weitere Produktangebote 214-44-624-01-670800

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214-44-624-01-670800 214-44-624-01-670800 Hersteller : Mill-Max Manufacturing Corp. 2017-11%3A108.pdf Description: CONN IC DIP SOCKET 24POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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