214-44-624-01-670800 Mill-Max
| Anzahl | Privatkunde |
|---|---|
| 1+ | 19.94 EUR |
| 10+ | 17.34 EUR |
| 25+ | 16.9 EUR |
| 48+ | 16.46 EUR |
| 112+ | 15.16 EUR |
| 256+ | 15.14 EUR |
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Technische Details 214-44-624-01-670800 Mill-Max
Description: CONN IC DIP SOCKET 24POS TIN, Part Status: Active, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 24 (2 x 12), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Surface Mount, Features: Closed Frame, Packaging: Tube.
Weitere Produktangebote 214-44-624-01-670800
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
|
214-44-624-01-670800 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS TINPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Surface Mount Features: Closed Frame Packaging: Tube |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 208 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 214-44-624-01-670800 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS TIN
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Surface Mount
Features: Closed Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 24POS TIN
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Surface Mount
Features: Closed Frame
Packaging: Tube
Produkt ist nicht verfügbar
Mindestbestellmenge: 208 Stücke
Im Einkaufswagen
Stück im Wert von UAH



