Produktrezensionen
Produktbewertung abgeben
Technische Details 214-7390-55-1902 3M
Description: CONN SOCKET SOIC 14POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: SOIC, Operating Temperature: -55°C ~ 150°C, Number of Positions or Pins (Grid): 14 (2 x 7), Termination: Solder, Housing Material: Polyethersulfone (PES), Glass Filled, Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 214-7390-55-1902 nach Preis ab 41.71 EUR bis 60.07 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
214-7390-55-1902 | 3M |
 Description: CONN SOCKET SOIC 14POS GOLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SOIC Operating Temperature: -55°C ~ 150°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyethersulfone (PES), Glass Filled Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 33 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
214-7390-55-1902 | 3M Electronic Solutions Division |
IC & Component Sockets BURN-IN SOIC SOCKET 14 Leads |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 214-7390-55-1902 |
|
Hersteller: 3M
Description: CONN SOCKET SOIC 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SOIC
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyethersulfone (PES), Glass Filled
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN SOCKET SOIC 14POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SOIC
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyethersulfone (PES), Glass Filled
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 56.71 EUR |
| 10+ | 48.2 EUR |
| 30+ | 44.6 EUR |
| 214-7390-55-1902 |
|
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets BURN-IN SOIC SOCKET 14 Leads
IC & Component Sockets BURN-IN SOIC SOCKET 14 Leads
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 60.07 EUR |
| 10+ | 51.06 EUR |
| 20+ | 47.24 EUR |
| 50+ | 45.57 EUR |
| 100+ | 43.4 EUR |
| 200+ | 41.71 EUR |