auf Bestellung 36 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 4+ | 52.66 EUR |
| 10+ | 43.16 EUR |
| 30+ | 38.46 EUR |
Produktrezensionen
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Technische Details 214-7390-55-1902 3M
Description: CONN SOCKET SOIC 14POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: SOIC, Operating Temperature: -55°C ~ 150°C, Number of Positions or Pins (Grid): 14 (2 x 7), Termination: Solder, Housing Material: Polyethersulfone (PES), Glass Filled, Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 214-7390-55-1902 nach Preis ab 39.34 EUR bis 56.71 EUR
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214-7390-55-1902 | Hersteller : 3M Electronic Solutions Division |
IC & Component Sockets BURN-IN SOIC SOCKET 14 Leads |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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214-7390-55-1902 | Hersteller : 3M |
Description: CONN SOCKET SOIC 14POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SOIC Operating Temperature: -55°C ~ 150°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyethersulfone (PES), Glass Filled Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 33 Stücke: Lieferzeit 10-14 Tag (e) |
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