auf Bestellung 52 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 3.45 EUR |
| 10+ | 2.96 EUR |
| 25+ | 2.75 EUR |
| 50+ | 2.62 EUR |
| 100+ | 2.48 EUR |
| 250+ | 2.32 EUR |
| 500+ | 2.22 EUR |
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Technische Details 214-99-316-01-670800 Mill-Max
Description: CONN IC DIP SOCKET 16POS TINLEAD, Features: Closed Frame, Packaging: Tube, Mounting Type: Surface Mount, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy, Part Status: Active.
Weitere Produktangebote 214-99-316-01-670800 nach Preis ab 2.28 EUR bis 3.52 EUR
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214-99-316-01-670800 | Hersteller : Mill-Max Manufacturing Corp. |
 Description: CONN IC DIP SOCKET 16POS TINLEADFeatures: Closed Frame Packaging: Tube Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
auf Bestellung 515 Stücke: Lieferzeit 10-14 Tag (e) |
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