216-7383-55-1902
Produktcode: 149611
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Lieblingsprodukt
Hersteller:
Steckverbinder, Reihenklemmen > Steckverbindungen sonstige
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Weitere Produktangebote 216-7383-55-1902 nach Preis ab 54.26 EUR bis 128.67 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
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216-7383-55-1902 | 3M Electronic Solutions Division |
IC & Component Sockets BURN-IN SOIC SOCKET 16 Leads |
auf Bestellung 26 Stücke: Lieferzeit 10-14 Tag (e) |
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216-7383-55-1902 | 3M |
Description: CONN SOCKET SOIC 16POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SOIC Operating Temperature: -55°C ~ 150°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyethersulfone (PES), Glass Filled Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 53 Stücke: Lieferzeit 10-14 Tag (e) |
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216-7383-55-1902 | 3M |
Conn SOIC Test Clip F 16 POS Solder ST Thru-Hole 1 Port Textool™ Box |
auf Bestellung 15 Stücke: Lieferzeit 14-21 Tag (e) |
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| 216-7383-55-1902 |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets BURN-IN SOIC SOCKET 16 Leads
IC & Component Sockets BURN-IN SOIC SOCKET 16 Leads
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 77.55 EUR |
| 10+ | 65.91 EUR |
| 20+ | 60.99 EUR |
| 50+ | 58.35 EUR |
| 100+ | 55.72 EUR |
| 200+ | 54.26 EUR |
| 216-7383-55-1902 |
|
Hersteller: 3M
Description: CONN SOCKET SOIC 16POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SOIC
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyethersulfone (PES), Glass Filled
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN SOCKET SOIC 16POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SOIC
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyethersulfone (PES), Glass Filled
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 53 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 81.54 EUR |
| 10+ | 69.29 EUR |
| 30+ | 64.13 EUR |
| 50+ | 61.86 EUR |
| 216-7383-55-1902 |
|
Hersteller: 3M
Conn SOIC Test Clip F 16 POS Solder ST Thru-Hole 1 Port Textool™ Box
Conn SOIC Test Clip F 16 POS Solder ST Thru-Hole 1 Port Textool™ Box
auf Bestellung 15 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 128.67 EUR |
| 3+ | 121.87 EUR |
| 5+ | 115.79 EUR |
| 10+ | 111.16 EUR |