216-7383-55-1902
Produktcode: 149611
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Lieblingsprodukt
Hersteller:
Steckverbinder, Reihenklemmen > Steckverbindungen sonstige
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Weitere Produktangebote 216-7383-55-1902 nach Preis ab 45.6 EUR bis 68.52 EUR
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216-7383-55-1902 | 3M Electronic Solutions Division |
IC & Component Sockets BURN-IN SOIC SOCKET 16 Leads |
auf Bestellung 29 Stücke: Lieferzeit 10-14 Tag (e) |
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216-7383-55-1902 | 3M |
Description: CONN SOCKET SOIC 16POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SOIC Operating Temperature: -55°C ~ 150°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyethersulfone (PES), Glass Filled Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 53 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 216-7383-55-1902 |
|
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets BURN-IN SOIC SOCKET 16 Leads
IC & Component Sockets BURN-IN SOIC SOCKET 16 Leads
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 65.17 EUR |
| 10+ | 55.39 EUR |
| 20+ | 51.25 EUR |
| 50+ | 49.03 EUR |
| 100+ | 46.82 EUR |
| 200+ | 45.6 EUR |
| 216-7383-55-1902 |
|
Hersteller: 3M
Description: CONN SOCKET SOIC 16POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SOIC
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyethersulfone (PES), Glass Filled
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN SOCKET SOIC 16POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SOIC
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyethersulfone (PES), Glass Filled
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 53 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 68.52 EUR |
| 10+ | 58.23 EUR |
| 30+ | 53.89 EUR |
| 50+ | 51.98 EUR |