| Anzahl | Preis |
|---|---|
| 1+ | 22.53 EUR |
| 10+ | 19.96 EUR |
| 25+ | 19.18 EUR |
| 50+ | 18.43 EUR |
| 100+ | 17.39 EUR |
| 250+ | 15.86 EUR |
| 500+ | 14.84 EUR |
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Technische Details 217346-3021 Molex
Description: MCIO RA 16X GEN530U1.50MM PEG, Contact Finish: Gold, Gender: Female, Features: Board Guide, Packaging: Bulk, Number of Rows: 2, Number of Positions/Bay/Row: 62, Contact Material: Copper Alloy, Contact Finish Thickness: 30.0µin (0.76µm), Termination: Solder, Card Thickness: 0.062" (1.57mm), Card Type: PCI Express™, Read Out: Dual, Operating Temperature: -40°C ~ 85°C, Pitch: 0.024" (0.60mm), Number of Positions: 124, Mounting Type: Surface Mount, Right Angle, Color: Black.
Weitere Produktangebote 217346-3021
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
2173463021 | Molex |
 Description: MCIO RA 16X GEN530U1.50MM PEGContact Finish: Gold Gender: Female Features: Board Guide Packaging: Bulk Number of Rows: 2 Number of Positions/Bay/Row: 62 Contact Material: Copper Alloy Contact Finish Thickness: 30.0µin (0.76µm) Termination: Solder Card Thickness: 0.062" (1.57mm) Card Type: PCI Express™ Read Out: Dual Operating Temperature: -40°C ~ 85°C Pitch: 0.024" (0.60mm) Number of Positions: 124 Mounting Type: Surface Mount, Right Angle Color: Black |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5280 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 2173463021 |
|
Hersteller: Molex
Description: MCIO RA 16X GEN530U1.50MM PEG
Contact Finish: Gold
Gender: Female
Features: Board Guide
Packaging: Bulk
Number of Rows: 2
Number of Positions/Bay/Row: 62
Contact Material: Copper Alloy
Contact Finish Thickness: 30.0µin (0.76µm)
Termination: Solder
Card Thickness: 0.062" (1.57mm)
Card Type: PCI Express™
Read Out: Dual
Operating Temperature: -40°C ~ 85°C
Pitch: 0.024" (0.60mm)
Number of Positions: 124
Mounting Type: Surface Mount, Right Angle
Color: Black
Description: MCIO RA 16X GEN530U1.50MM PEG
Contact Finish: Gold
Gender: Female
Features: Board Guide
Packaging: Bulk
Number of Rows: 2
Number of Positions/Bay/Row: 62
Contact Material: Copper Alloy
Contact Finish Thickness: 30.0µin (0.76µm)
Termination: Solder
Card Thickness: 0.062" (1.57mm)
Card Type: PCI Express™
Read Out: Dual
Operating Temperature: -40°C ~ 85°C
Pitch: 0.024" (0.60mm)
Number of Positions: 124
Mounting Type: Surface Mount, Right Angle
Color: Black
Produkt ist nicht verfügbar
Mindestbestellmenge: 5280 Stücke
Im Einkaufswagen
Stück im Wert von UAH