2177160641 Molex
Hersteller: MolexDescription: 0.175BTB QUADROWGEN2 REC EMBSTPP
Features: Solder Retention
Packaging: Bulk
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 64
Pitch: 0.007" (0.18mm)
Height Above Board: 0.023" (0.59mm)
Contact Finish Thickness: 3.94µin (0.100µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 4
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Technische Details 2177160641 Molex
Description: 0.175BTB QUADROWGEN2 REC EMBSTPP, Features: Solder Retention, Packaging: Bulk, Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 64, Pitch: 0.007" (0.18mm), Height Above Board: 0.023" (0.59mm), Contact Finish Thickness: 3.94µin (0.100µm), Mated Stacking Heights: 0.6mm, Number of Rows: 4.
Weitere Produktangebote 2177160641
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| 217716-0641 | Hersteller : Molex | Board to Board & Mezzanine Connectors 0.175 BtB QuadRow Gen2 Rec Embstp Pkg 64ckt |
Produkt ist nicht verfügbar |