2189890400 Molex
Hersteller: Molex
Description: MICRO-FIT+SR SMT RA NAIL 4CKT TI
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header
Voltage Rating: 600VAC/DC
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount, Right Angle
Number of Positions: 4
Number of Rows: 1
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.173" (4.40mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
| Anzahl | Preis |
|---|---|
| 320+ | 9.28 EUR |
| 640+ | 8.84 EUR |
| 960+ | 8.59 EUR |
| 1600+ | 8.28 EUR |
Produktrezensionen
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Technische Details 2189890400 Molex
Description: MICRO-FIT+SR SMT RA NAIL 4CKT TI, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 600VAC/DC, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Right Angle, Number of Positions: 4, Number of Rows: 1, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Copper Alloy, Insulation Color: Black, Pitch - Mating: 0.118" (3.00mm), Contact Finish - Mating: Tin, Contact Finish - Post: Tin, Contact Shape: Square, Insulation Height: 0.173" (4.40mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled.
Weitere Produktangebote 2189890400 nach Preis ab 8.08 EUR bis 13.96 EUR
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218989-0400 | Molex | Headers & Wire Housings Micro-Fit+ RA Header SMT 3mm Pitch Single Row 4 Ckts Matte (Sn) Plating Glow-Wire Solder Nail Blk |
auf Bestellung 10887 Stücke: Lieferzeit 10-14 Tag (e) |
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2189890400 | Molex |
Description: MICRO-FIT+SR SMT RA NAIL 4CKT TI Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 600VAC/DC Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount, Right Angle Number of Positions: 4 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.173" (4.40mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled |
auf Bestellung 5439 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 218989-0400 |
Hersteller: Molex
Headers & Wire Housings Micro-Fit+ RA Header SMT 3mm Pitch Single Row 4 Ckts Matte (Sn) Plating Glow-Wire Solder Nail Blk
Headers & Wire Housings Micro-Fit+ RA Header SMT 3mm Pitch Single Row 4 Ckts Matte (Sn) Plating Glow-Wire Solder Nail Blk
auf Bestellung 10887 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 12.69 EUR |
| 10+ | 10.7 EUR |
| 25+ | 10.61 EUR |
| 50+ | 10.47 EUR |
| 100+ | 8.73 EUR |
| 250+ | 8.71 EUR |
| 500+ | 8.08 EUR |
| 2189890400 |
|
Hersteller: Molex
Description: MICRO-FIT+SR SMT RA NAIL 4CKT TI
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 600VAC/DC
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount, Right Angle
Number of Positions: 4
Number of Rows: 1
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.173" (4.40mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Description: MICRO-FIT+SR SMT RA NAIL 4CKT TI
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 600VAC/DC
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount, Right Angle
Number of Positions: 4
Number of Rows: 1
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.173" (4.40mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
auf Bestellung 5439 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 13.96 EUR |
| 10+ | 11.37 EUR |
| 100+ | 9.27 EUR |