22-4501-30 Aries Electronics

Description: CONN IC DIP SOCKET 22POS TIN, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Wire Wrap, Number of Positions or Pins (Grid): 22 (2 x 11), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.4" (10.16mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Phosphor Bronze, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm).