| Anzahl | Privatkunde |
|---|---|
| 1+ | 4.94 EUR |
| 10+ | 4.19 EUR |
| 25+ | 3.92 EUR |
| 50+ | 3.75 EUR |
| 100+ | 3.56 EUR |
| 250+ | 3.2 EUR |
| 500+ | 3.12 EUR |
Artikel auf Bestellung
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Lieferzeit:
10-14 Tag (e)
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Technische Details 22-4518-10 Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 22 (2 x 11), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 22-4518-10 nach Preis ab 3.97 EUR bis 12.47 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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22-4518-10 | Aries Electronics |
 Description: CONN IC DIP SOCKET 22POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 154 Stücke: Lieferzeit 10-14 Tag (e) |
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22-4518-10 | ARIES |
Description: ARIES - 22-4518-10 - IC- & Baustein-Sockel, 22 Kontakt(e), DIP, 2.54 mm, 518, 10.16 mm, Berylliumkupfer tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Berylliumkupfer isCanonical: Y Anzahl der Kontakte: 22Kontakt(e) Reihenabstand: 10.16mm Steckverbinder: DIP Produktpalette: 518 productTraceability: No usEccn: EAR99 Rastermaß: 2.54mm |
auf Bestellung 55 Stücke: Lieferzeit 14-21 Tag (e) |
|
| 22-4518-10 |
|
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 154 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 5.49 EUR |
| 10+ | 4.68 EUR |
| 25+ | 4.38 EUR |
| 50+ | 4.18 EUR |
| 100+ | 3.97 EUR |
| 22-4518-10 |
|
Hersteller: ARIES
Description: ARIES - 22-4518-10 - IC- & Baustein-Sockel, 22 Kontakt(e), DIP, 2.54 mm, 518, 10.16 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 22Kontakt(e)
Reihenabstand: 10.16mm
Steckverbinder: DIP
Produktpalette: 518
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
Description: ARIES - 22-4518-10 - IC- & Baustein-Sockel, 22 Kontakt(e), DIP, 2.54 mm, 518, 10.16 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 22Kontakt(e)
Reihenabstand: 10.16mm
Steckverbinder: DIP
Produktpalette: 518
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
auf Bestellung 55 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 21+ | 12.47 EUR |
| 28+ | 8.54 EUR |