| Anzahl | Privatkunde |
|---|---|
| 1+ | 4.94 EUR |
| 10+ | 4.19 EUR |
| 25+ | 3.92 EUR |
| 50+ | 3.75 EUR |
| 100+ | 3.56 EUR |
| 250+ | 3.2 EUR |
| 500+ | 3.12 EUR |
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Technische Details 22-4518-10 Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 22 (2 x 11), Type: DIP, 0.4" (10.16mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Bulk, Part Status: Active, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper.
Weitere Produktangebote 22-4518-10 nach Preis ab 3.97 EUR bis 5.49 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
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22-4518-10 | Aries Electronics |
 Description: CONN IC DIP SOCKET 22POS GOLDContact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 22 (2 x 11) Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Part Status: Active Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper |
auf Bestellung 154 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 22-4518-10 |
|
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Description: CONN IC DIP SOCKET 22POS GOLD
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
auf Bestellung 154 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 5.49 EUR |
| 10+ | 4.68 EUR |
| 25+ | 4.38 EUR |
| 50+ | 4.18 EUR |
| 100+ | 3.97 EUR |