22-4518-10M Aries Electronics
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
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Technische Details 22-4518-10M Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 22 (2 x 11), Type: DIP, 0.4" (10.16mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Bulk.
Weitere Produktangebote 22-4518-10M
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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22-4518-10M | Hersteller : Aries Electronics |
IC & Component Sockets OPEN FRAME COLLET SOLDER TAIL 22 PINS |
Produkt ist nicht verfügbar |