22-4518-11 Aries Electronics
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
| Anzahl | Preis |
|---|---|
| 2+ | 9.01 EUR |
| 10+ | 7.66 EUR |
| 25+ | 7.18 EUR |
| 50+ | 6.84 EUR |
| 100+ | 6.51 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 22-4518-11 Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 22 (2 x 11), Type: DIP, 0.4" (10.16mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Bulk, Part Status: Active, Contact Material - Post: Brass, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm).
Weitere Produktangebote 22-4518-11 nach Preis ab 6.46 EUR bis 9.68 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
22-4518-11 | Hersteller : Aries Electronics |
IC & Component Sockets OPEN FRAME COLLET SOLDER TAIL 22 PINS |
auf Bestellung 37 Stücke: Lieferzeit 10-14 Tag (e) |
|