220-7201-55-1902 3M Electronic Solutions Division
| Anzahl | Privatkunde |
|---|---|
| 1+ | 86.94 EUR |
| 10+ | 73.91 EUR |
| 20+ | 68.38 EUR |
| 50+ | 65.95 EUR |
| 100+ | 62.83 EUR |
| 200+ | 61.48 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 220-7201-55-1902 3M Electronic Solutions Division
Description: CONN SOCKET SOIC 20POS GOLD, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Contact Material - Mating: Beryllium Copper, Contact Finish - Mating: Gold, Housing Material: Polyethersulfone (PES), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 20 (2 x 10), Operating Temperature: -55°C ~ 150°C, Type: SOIC, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Weitere Produktangebote 220-7201-55-1902 nach Preis ab 77.67 EUR bis 270.87 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
220-7201-55-1902 | 3M |
 Description: CONN SOCKET SOIC 20POS GOLDPart Status: Active Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Finish - Post: Gold Contact Material - Mating: Beryllium Copper Contact Finish - Mating: Gold Housing Material: Polyethersulfone (PES), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 20 (2 x 10) Operating Temperature: -55°C ~ 150°C Type: SOIC Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
 |
220-7201-55-1902 | 3M |
Conn SOIC Test Clip RCP 20 POS Solder ST Thru-Hole 20 Port Box |
auf Bestellung 10 Stücke: Lieferzeit 14-21 Tag (e) |
|
| 220-7201-55-1902 |
|
Hersteller: 3M
Description: CONN SOCKET SOIC 20POS GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Gold
Housing Material: Polyethersulfone (PES), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 150°C
Type: SOIC
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: CONN SOCKET SOIC 20POS GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Gold
Housing Material: Polyethersulfone (PES), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 150°C
Type: SOIC
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 91.4 EUR |
| 10+ | 77.67 EUR |
| 220-7201-55-1902 |
|
Hersteller: 3M
Conn SOIC Test Clip RCP 20 POS Solder ST Thru-Hole 20 Port Box
Conn SOIC Test Clip RCP 20 POS Solder ST Thru-Hole 20 Port Box
auf Bestellung 10 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 270.87 EUR |
| 2+ | 257.42 EUR |
| 3+ | 243.9 EUR |
| 5+ | 231.86 EUR |
| 10+ | 222.74 EUR |