220-7201-55-1902 3M Electronic Solutions Division
| Anzahl | Privatkunde |
|---|---|
| 1+ | 86.94 EUR |
| 10+ | 73.91 EUR |
| 20+ | 68.38 EUR |
| 50+ | 65.95 EUR |
| 100+ | 62.83 EUR |
| 200+ | 61.48 EUR |
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Lieferzeit:
10-14 Tag (e)
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Technische Details 220-7201-55-1902 3M Electronic Solutions Division
Description: CONN SOCKET SOIC 20POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: SOIC, Operating Temperature: -55°C ~ 150°C, Number of Positions or Pins (Grid): 20 (2 x 10), Termination: Solder, Housing Material: Polyethersulfone (PES), Glass Filled, Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 220-7201-55-1902 nach Preis ab 67.08 EUR bis 277.09 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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220-7201-55-1902 | 3M |
 Description: CONN SOCKET SOIC 20POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SOIC Operating Temperature: -55°C ~ 150°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polyethersulfone (PES), Glass Filled Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 53 Stücke: Lieferzeit 10-14 Tag (e) |
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220-7201-55-1902 | 3M |
Conn SOIC Test Clip RCP 20 POS Solder ST Thru-Hole 20 Port Box |
auf Bestellung 10 Stücke: Lieferzeit 14-21 Tag (e) |
|
| 220-7201-55-1902 |
|
Hersteller: 3M
Description: CONN SOCKET SOIC 20POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SOIC
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyethersulfone (PES), Glass Filled
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN SOCKET SOIC 20POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SOIC
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyethersulfone (PES), Glass Filled
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 53 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 88.41 EUR |
| 10+ | 75.14 EUR |
| 30+ | 69.53 EUR |
| 50+ | 67.08 EUR |
| 220-7201-55-1902 |
|
Hersteller: 3M
Conn SOIC Test Clip RCP 20 POS Solder ST Thru-Hole 20 Port Box
Conn SOIC Test Clip RCP 20 POS Solder ST Thru-Hole 20 Port Box
auf Bestellung 10 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 277.09 EUR |
| 2+ | 263.35 EUR |
| 3+ | 249.51 EUR |
| 5+ | 237.19 EUR |
| 10+ | 227.86 EUR |