220-7201-55-1902 3M Electronic Solutions Division
| Anzahl | Preis |
|---|---|
| 1+ | 73.06 EUR |
| 10+ | 62.11 EUR |
| 20+ | 57.46 EUR |
| 50+ | 55.42 EUR |
| 100+ | 52.8 EUR |
| 200+ | 51.66 EUR |
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Technische Details 220-7201-55-1902 3M Electronic Solutions Division
Description: CONN SOCKET SOIC 20POS GOLD, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Contact Material - Mating: Beryllium Copper, Contact Finish - Mating: Gold, Housing Material: Polyethersulfone (PES), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 20 (2 x 10), Operating Temperature: -55°C ~ 150°C, Type: SOIC, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Weitere Produktangebote 220-7201-55-1902 nach Preis ab 65.27 EUR bis 76.81 EUR
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220-7201-55-1902 | 3M |
 Description: CONN SOCKET SOIC 20POS GOLDPart Status: Active Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Finish - Post: Gold Contact Material - Mating: Beryllium Copper Contact Finish - Mating: Gold Housing Material: Polyethersulfone (PES), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 20 (2 x 10) Operating Temperature: -55°C ~ 150°C Type: SOIC Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 220-7201-55-1902 |
|
Hersteller: 3M
Description: CONN SOCKET SOIC 20POS GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Gold
Housing Material: Polyethersulfone (PES), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 150°C
Type: SOIC
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: CONN SOCKET SOIC 20POS GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Gold
Housing Material: Polyethersulfone (PES), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 150°C
Type: SOIC
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 76.81 EUR |
| 10+ | 65.27 EUR |