224-5248-00-0602J 3M
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 43 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 54.31 EUR |
10+ | 47.56 EUR |
25+ | 45.51 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 224-5248-00-0602J 3M
Description: CONN IC DIP SOCKET ZIF 24POS GLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Connector, Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Press-Fit, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 224-5248-00-0602J nach Preis ab 40.5 EUR bis 54.54 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||||||||
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224-5248-00-0602J | Hersteller : 3M Electronic Solutions Division | IC & Component Sockets 0.100" DIP SOCKET 24 Contact Qty. |
auf Bestellung 30 Stücke: Lieferzeit 88-92 Tag (e) |
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224-5248-00-0602J | Hersteller : 3M | Conn DIP Socket SKT 24 POS 2.54mm Solder ST Thru-Hole Box |
Produkt ist nicht verfügbar |
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224-5248-00-0602J | Hersteller : 3M | Conn DIP Socket SKT 24 POS 2.54mm Solder ST Thru-Hole Box |
Produkt ist nicht verfügbar |
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224-5248-00-0602J | Hersteller : 3M Interconnect Solutions | Conn DIP Socket SKT 24 POS 2.54mm Solder ST Thru-Hole Box |
Produkt ist nicht verfügbar |
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224-5248-00-0602J | Hersteller : 3M Interconnect Solutions | Conn DIP Socket SKT 24 POS 2.54mm Solder ST Thru-Hole Box |
Produkt ist nicht verfügbar |