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Technische Details 228-1277-00-0602J 3M
Description: CONN IC DIP SOCKET ZIF 28POS GLD, Packaging: Tube, Features: Closed Frame, Mounting Type: Connector, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Press-Fit, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 228-1277-00-0602J nach Preis ab 29.5 EUR bis 50.65 EUR
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228-1277-00-0602J | 3M Electronic Solutions Division |
 IC & Component Sockets 0.100" DIP SOCKET 28 Contact Qty. |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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228-1277-00-0602J | 3M |
Description: CONN IC DIP SOCKET ZIF 28POS GLD Packaging: Tube Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 82 Stücke: Lieferzeit 10-14 Tag (e) |
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228-1277-00-0602J | 3M |
Conn DIP Socket RCP 28 POS 2.54mm Solder ST Thru-Hole Box |
auf Bestellung 30 Stücke: Lieferzeit 14-21 Tag (e) |
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| 228-1277-00-0602J |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 0.100" DIP SOCKET 28 Contact Qty.
IC & Component Sockets 0.100" DIP SOCKET 28 Contact Qty.
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 43.75 EUR |
| 10+ | 37.1 EUR |
| 20+ | 33.83 EUR |
| 50+ | 32.38 EUR |
| 100+ | 30.98 EUR |
| 200+ | 29.64 EUR |
| 500+ | 29.5 EUR |
| 228-1277-00-0602J |
|
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 82 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 43.79 EUR |
| 10+ | 37.22 EUR |
| 30+ | 34.44 EUR |
| 50+ | 33.22 EUR |
| 228-1277-00-0602J |
|
Hersteller: 3M
Conn DIP Socket RCP 28 POS 2.54mm Solder ST Thru-Hole Box
Conn DIP Socket RCP 28 POS 2.54mm Solder ST Thru-Hole Box
auf Bestellung 30 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 50.65 EUR |
| 5+ | 48.27 EUR |
| 10+ | 40.14 EUR |