2288BG Boyd Laconia, LLC
Hersteller: Boyd Laconia, LLC
Description: 2288BG
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Attachment Method: Thermal Tape, Adhesive (Not Included)
Package Cooled: BGA
Type: Board Level
Shape: Cylindrical
Diameter: 0.300" (7.62mm) ID, 1.000" (25.40mm) OD
Packaging: Bulk
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Technische Details 2288BG Boyd Laconia, LLC
Description: 2288BG, Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM, Power Dissipation @ Temperature Rise: 1.5W @ 40°C, Attachment Method: Thermal Tape, Adhesive (Not Included), Package Cooled: BGA, Type: Board Level, Shape: Cylindrical, Diameter: 0.300" (7.62mm) ID, 1.000" (25.40mm) OD, Packaging: Bulk.
Weitere Produktangebote 2288BG
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| 2288BG | Hersteller : BOYD CORP |
 Category: HeatsinksDescription: Heatsink: extruded; BGA Application: BGA Type of heatsink: extruded |
Produkt ist nicht verfügbar |