232-1287-00-0602J 3M Electronic Solutions Division
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 0.100" DIP SOCKET 32 Contact Qty.
| Anzahl | Privatkunde |
|---|---|
| 1+ | 80.86 EUR |
| 10+ | 71.46 EUR |
| 20+ | 63.61 EUR |
| 50+ | 61.34 EUR |
| 100+ | 58.43 EUR |
| 200+ | 56.8 EUR |
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Technische Details 232-1287-00-0602J 3M Electronic Solutions Division
Description: CONN IC DIP SOCKET ZIF 32POS GLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Connector, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Press-Fit, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 232-1287-00-0602J nach Preis ab 82.42 EUR bis 82.42 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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232-1287-00-0602J | 3M |
Description: CONN IC DIP SOCKET ZIF 32POS GLD Packaging: Bulk Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 232-1287-00-0602J |
|
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 82.42 EUR |