24-3518-10 Aries Electronics
| Anzahl | Privatkunde |
|---|---|
| 16+ | 3.75 EUR |
| 32+ | 3.36 EUR |
| 112+ | 3.22 EUR |
| 256+ | 3.06 EUR |
| 512+ | 3.01 EUR |
| 1008+ | 2.92 EUR |
| 2512+ | 2.83 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 24-3518-10 Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 24 (2 x 12), Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Bulk, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper.
Weitere Produktangebote 24-3518-10 nach Preis ab 3.55 EUR bis 9.52 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
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24-3518-10 | Aries Electronics |
 Description: CONN IC DIP SOCKET 24POS GOLDContact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper |
auf Bestellung 134 Stücke: Lieferzeit 10-14 Tag (e) |
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24-3518-10 | ARIES |
Description: ARIES - 24-3518-10 - IC- & Baustein-Sockel, 24 Kontakt(e), DIP, 2.54 mm, 518, 7.62 mm, Berylliumkupfer tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Berylliumkupfer isCanonical: Y Anzahl der Kontakte: 24Kontakt(e) Reihenabstand: 7.62mm Steckverbinder: DIP Produktpalette: 518 productTraceability: No usEccn: EAR99 Rastermaß: 2.54mm |
auf Bestellung 258 Stücke: Lieferzeit 14-21 Tag (e) |
|
| 24-3518-10 |
|
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Description: CONN IC DIP SOCKET 24POS GOLD
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
auf Bestellung 134 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.94 EUR |
| 16+ | 4.07 EUR |
| 32+ | 3.87 EUR |
| 64+ | 3.69 EUR |
| 112+ | 3.55 EUR |
| 24-3518-10 |
|
Hersteller: ARIES
Description: ARIES - 24-3518-10 - IC- & Baustein-Sockel, 24 Kontakt(e), DIP, 2.54 mm, 518, 7.62 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 24Kontakt(e)
Reihenabstand: 7.62mm
Steckverbinder: DIP
Produktpalette: 518
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
Description: ARIES - 24-3518-10 - IC- & Baustein-Sockel, 24 Kontakt(e), DIP, 2.54 mm, 518, 7.62 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 24Kontakt(e)
Reihenabstand: 7.62mm
Steckverbinder: DIP
Produktpalette: 518
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
auf Bestellung 258 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 27+ | 9.52 EUR |
| 36+ | 6.57 EUR |
| 100+ | 4.82 EUR |
| 250+ | 4.52 EUR |